Telit allies with Deutsche Telekom for nuSIM Solution to drive growth in mobile IoT

Telit announced that it is a partner for Deutsche Telekom’s nuSIM initiative. The achievement is the latest milestone in Telit’s longstanding partnership with Deutsche Telekom to grow the IoT market by providing breakthrough technologies and services.

The nuSIM initiative takes a fundamentally new approach to IoT system design by moving the subscriber identity module’s (SIM) functionality to the cellular chipset. The IoT device has the mobile operators’ credentials securely programmed during manufacturing, eliminating the need for the traditional physical SIM card.

As a result, the nuSIM architecture streamlines design and manufacturing processes by eliminating the need for contacts, circuit paths, card holders and other components associated with physical SIMs; enables ultra-compact device form factors that would not be possible with a physical SIM card, such as healthcare wearables and industrial sensors.

It also maximizes battery life by leveraging advanced power saving methods that are achievable only when the modem and SIM share the same underlying hardware; enables faster IoT deployments because each module ships with a fully operational integrated SIM, and eliminates overhead costs related to SIM logistics, such as stock keeping and handling.

nuSIM enables a new generation of IoT devices, applications and business models that would not be possible due to the physical SIM card’s inherent cost, complexity, size, power consumption and other limitations. nuSIM’s benefits also complement mobile IoT technologies, which are designed to enable a wider range of IoT devices and use cases by reducing cost, size and power requirements.   

Telit is a Deutsche Telekom partner and was the first module supplier to become an active contributor in the nuSIM initiative. Telit’s role includes contributing to the nuSIM design process and serving as a test bed for the technology.

With nuSIM, Deutsche Telekom moves the SIM functionality from the physical SIM card directly to the chipset. nuSIM is designed for low-cost devices used in mobile IoT applications with a long life-span, such as asset trackers or smart motion or temperature sensors. It will be commercially available in the second half of this year.

“Deutsche Telekom has built a solid track record in IoT technology innovation over the past years. The most important success driver for us is to anticipate customer needs to make sure we enable their business success,” says Ingo Hofacker, Senior Vice President, responsible for the IoT business at Deutsche Telekom. “nuSIM, our rigorously optimized SIM solution for the cost-sensitive mobile IoT market is our latest endeavor and an important building block for our offering moving forward.”

Making it simple!

The elimination of the physical SIM card simplifies the form factor of an IoT device as there are no additional contacts, circuit paths or SIM card holders to consider. nuSIM provides a minimum hardware and software footprint for cost-efficient implementations with minimal power consumption.  

This brings simplicity as well as cost and time savings along the IoT value chain. Device vendors benefit from better design options due to smaller package size and extended battery life. SIM logistics, such as stock keeping or handling, are no longer necessary.

IoT service providers can save costs through a simple digital process which puts the operator’s credentials onto the device during manufacturing time. Customers also benefit from the lower device cost. In addition, they can start their mobile IoT project quicker and easier since a fully operational SIM is already on board.

Deutsche Telekom has partnered with world leaders in the respective fields of IoT chipsets, modules and digital security to cooperate on nuSIM. An open specification set ensures interoperability for the secure provisioning of operator credentials during module or device production. The partners include for chipsets – Altair Semiconductor, Commsolid/Goodix, HiSilicon, Nordic Semiconductor, Qualcomm Technologies, Samsung Electronics and Sequans Communications; for modules – Quectel Wireless Solutions, Sierra Wireless, Telit, u-blox, Nordic Semiconductor; and for digital security: Giesecke+Devrient Mobile Security.

“nuSIM is a game-changer for IoT by enabling a new range of devices that are inexpensive to design, manufacture and own, have significantly longer battery-life, and can be rapidly deployed,” said Omer Harel, Director of SIM Technologies at Telit. “Telit’s expertise positioned us quite uniquely to provide guidance to the nuSIM initiative particularly in constructing test cases and running them for Deutsche Telecom.”

“Deutsche Telekom is proud to work with Telit and other industry-leading partners to bring nuSIM to the market,” said Stefan Kaliner, Head of UICC Development at Deutsche Telekom. “Moving the SIM functionality from the physical SIM card directly to the chipset brings significant cost, time and space savings across the IoT value chain. The new form factor paves the way for further innovation as companies develop the next generation of mobile IoT applications.”

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