Qualcomm Inc. announced Wednesday that its subsidiary, Qualcomm Technologies is introducing the Snapdragon 600E and 410E processors, for embedded applications in many verticals such as digital signage, set-top-boxes, medical imaging, point of sale systems, industrial robotics, and other Internet of Things (IoT) related applications. Qualcomm Technologies has utilized its mobile investment in Snapdragon processors to introduce solutions for product categories beyond smartphones.
The Snapdragon 600E and 410E are being made available globally by third party distributors, initially through Arrow Electronics, for a minimum of ten years from the Snapdragon 600 and Snapdragon 400 (respectively) product families’ first commercial sampling. This is the first time stand-alone Snapdragon processors are available by distributors, making them accessible in a variety of quantities to manufacturers of all sizes for embedded computing and IoT products.
The Snapdragon 600E featuring 1.5GHz quad-core Qualcomm Krait 300 CPU is the ideal processor for building advanced systems with multi-core performance and immersive 3D graphics, based on the Qualcomm Adreno 320 GPU and Qualcomm Hexagon DSP. It supports integrated Bluetooth 4.0/LE & 3.x, 802.11 a/b/g/n/ac and GPS for connected applications. It is also highly expandable for a variety of use cases with SATA, SD3.0, DDR memory, eMMC storage, HDMI, LVDS, HSIC, and PCIe interfaces.
The Snapdragon 410E 1.2GHz quad-core processor offers high performance, low power consumption and rich multimedia with an Adreno 306 GPU and Hexagon DSP. It supports Bluetooth 4.1/LE, 802.11 b/g/n and GPS, making it ideal for IoT use cases in smart homes, digital signage, medical equipment, industrial automation, digital media players and smart surveillance.
“The introduction of Snapdragon 600E and 410E offers a broad range of product options,” said David West, senior vice president, Arrow Electronics. “Arrow looks forward to offering Qualcomm Technologies’ Snapdragon processors and complementing them with the full range of parts and engineering services we can offer to help customers through commercialization.”
The introduction of the Snapdragon 600E and 410E processors, along with their global availability by distributors, is an important extension of the Snapdragon embedded product portfolio and its ability to address the needs of highly fragmented consumer, enterprise and industrial categories.
The Snapdragon embedded portfolio has a tiered offering that includes development boards, commercial-ready modules, as well as the discrete processors for chip on board designs. These embedded processors offer device manufacturers, solution providers, and system integrators tremendous options for speeding commercialization through a variety of off-the-shelf and custom modules, as well as the freedom for a chip on board design for a cost-optimized approach unique to their requirements.
“Snapdragon is a powerful and versatile processor with many potential applications in a wide variety of IoT applications and we can now offer this technology to a much wider range of customers with the additional benefit of long-term support and availability,” said Raj Talluri, senior vice president, product management, Qualcomm Technologies. “The Snapdragon 600E and 410E bring together some of our best connectivity and compute technologies to meet the needs for a large range of embedded and IoT applications.”
Built from the foundation of the Snapdragon 600 and 410 processors in the Company’s mobile portfolio, Snapdragon 600E and 410E join a family of solutions to support manufacturers from initial concept all the way to commercialization.
Users have the flexibility to start their evaluation and development with the highly accessible DragonBoard 410c community development board manufactured by Arrow Electronics, which is compliant with the 96Boards consumer edition open hardware specification. They can then select from off-the-shelf or custom modules, or choose to use the Snapdragon 600E or 410E with a minimum of 10 years extend life support and availability through 2025, in an optimized chip on board design.