Qualcomm boosts IoT interoperability with development kits supporting wireless technologies and cloud ecosystems

Qualcomm Technologies, a subsidiary of Qualcomm Inc., announced on Wednesday new Internet of Things (IoT) development kits based on the QCA4020 and QCA4024 system-on-chips (SoCs). The development kits are designed to help developers and device manufacturers create unique IoT products that work in concert with a wide variety of other devices and cloud ecosystems.

The kits are designed for IoT applications such as smart cities, toys, home control and automation, appliances, networking and home entertainment. The kits provide interoperability among diverse IoT devices including popular wireless standards, protocols and communication frameworks, and ease connectivity to various cloud and application services.

The QCA4020 is a tri-mode connectivity solution with advanced smart coexistence, integrating numerous wireless communication technologies into a single SoC, a proven approach to address fragmentation in many technology areas. It combines the latest specifications of Wi-Fi, Bluetooth Low Energy 5 and 802.15.4 based technologies, including ZigBee and Thread, while the QCA4024 integrates Bluetooth Low Energy 5 and 802.15.4 based technologies, including ZigBee and Thread.

The integration of these multiple radios is designed to allow the development of products capable of understanding and translating information in environments using disparate wireless technologies – such as a smart home where light bulbs and switches use ZigBee, speakers communicate via Bluetooth, and TVs and thermostats communicate via Wi-Fi.

QCA4020 and QCA4024 also feature dual core processing, integrated sensor hub, and a high degree of software flexibility to support multiple protocols, connectivity frameworks and cloud services. Both SoCs come with pre-integrated support for HomeKit and the Open Connectivity Foundation (OCF) specifications, as well as support for Amazon Web Services (AWS) IoT services software development kit (SDK) and Microsoft Azure Internet of Things (IoT) Devices SDK to connect with Azure IoT Hub and integrate with services like Azure Machine Learning and Azure Time Series Insights.

Additionally, both solutions have advanced hardware-based security features to help improve device protection in ways not possible with just software. Security capabilities include secure boot from hardware root of trust, trusted execution environment, hardware crypto engines, storage security, debug security with lifecycle control, key provisioning and wireless protocol security, combined in a low power, cost-optimized single-chip solution.

“By including the rich capabilities of the QCA4020 and QCA4024 in these development kits, we are helping streamline innovation for developers and manufacturers looking to build devices for smart homes, appliances, smart cities, home entertainment, toys, and many other exciting areas of the IoT,” said Joseph Bousaba, vice president, product management, Qualcomm Atheros. “These easy-to-use kits provide connectivity, interoperability and hardware security, allowing the creation of IoT devices that customers can quickly productize and integrate easily across multiple ecosystems.”

Qualcomm also introduced the Qualcomm Snapdragon 820E embedded platform and extended its embedded computing portfolio to support premium tier applications for the Internet of Things (IoT). The solution showcases how Qualcomm Technologies uses its mobile expertise in both computing and connectivity for commercial IoT products.

The Snapdragon 820E embedded platform is designed to support connected computing, and power-efficient multicore processing for computer vision, artificial intelligence and immersive multimedia – all in one package for next generation of IoT applications such as virtual reality, digital signage, smart retail, robotics and more.

The Snapdragon 820E embedded platform is being made available globally by third party distributors, initially through Arrow Electronics, for 10 years from commercial sample (until 2025). With the new DragonBoard 820c development board offered by Arrow Electronics, end customers and ecosystem participants can begin their evaluation and invention with the Snapdragon 820E embedded platform. DragonBoard 820c, is a 96Boards compliant open hardware specification, making it a highly expandable starting point for invention.

Device manufacturers, solution providers, and system integrators now have a rich set of options for speeding commercialization of products based on the Snapdragon 820E embedded platform through using a variety of off-the-shelf and custom modules, as well as the freedom for chip-on-board design for a cost-optimized approach unique to their requirements.

The Snapdragon 820E embedded platform joins the Qualcomm Snapdragon 410E and 600E embedded platforms in a tiered offering designed to address the needs of highly diverse consumer, enterprise and industrial embedded device categories.

The Snapdragon 820E embedded platform, featuring a 64-bit ARMv8 -compliant quad-core Qualcomm Kryo CPU, is an ideal processor for building advanced systems with multi-core performance and immersive 3D graphics, thanks to the Qualcomm Adreno 530 GPU and Qualcomm Hexagon 680 DSP. The embedded platform also supports Bluetooth/Wi-Fi, six position location satellite systems and high quality multi-channel audio.

“We are excited to introduce the award-winning premium tier Snapdragon 820 platform series to our extended life embedded portfolio, helping innovators everywhere create exciting and innovative IoT products,” said Jim Tran, senior vice president of product management, Qualcomm Technologies. “The Snapdragon 820E is a powerful and versatile embedded platform that is designed to support both complex connected computing and immersive visual graphics while providing the ultimate in performance and power efficiency that is ideal for small form factors and a wide variety of cutting-edge IoT applications.”

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