Micron Technology announced that it is working with Qualcomm Technologies to enable an advanced automotive connectivity solution that leverages 5G networks for autonomous driving and direct cellular vehicle-to-everything (C-V2X) communication.
The Qualcomm Snapdragon Automotive 5G Platform will feature a custom Micron 149 ball count multi-chip package, allowing for speeds of up to 20 times faster than current LTE-Advanced modems. Faster modem speeds widen the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.
The Snapdragon Automotive 5G Platform with integrated C-V2X direct communication technology is designed to provide the low latency, high data speed, and reliable cellular connection coverage required for next-generation connected cars and autonomous driving.
Micron created a portfolio of ultra-small 8×9.5mm, 149 ball count multi-chip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform, creating opportunities for immersive in-vehicle experiences and automotive safety.
Micron’s broad portfolio of volatile and nonvolatile memory products is optimized for automotive applications and supported by a formal product longevity program. Micron’s wafer fabrication facility located in Manassas, Virginia, is a production plant dedicated to long-lifecycle memory and storage technologies.
The company is initial memory solutions provider to earn International Automotive Task Force (IATF) 16949:2016 quality certification, a key milestone that is a clear reflection of Micron’s relentless commitment to quality.
“5G technology will drive further innovation in connected vehicles and deliver advanced functionality that is necessary for next-generation vehicles,” said Kris Baxter, vice president of marketing for Micron’s Embedded Business Unit. “Integrating Micron’s multi-chip package with the Snapdragon Automotive 5G Platform will accelerate the push toward digitally enabled transportation solutions that enhance reliability and safety.”
