Micron Technology unveiled on Thursday its embedded SLC NAND Flash optimized for the next generation of Internet of Things (IoT) and automotive applications. Available with differing interfaces to accommodate design, Micron’s second generation Serial (SPI) NAND and fifth generation parallel SLC NAND, offers improved reliability and read and program performance, ease of design and advanced security features.
Gartner projects that the IoT endpoint hardware and services market will rise to a US$3.5 trillion industry by 2020. As system designers seek embedded solutions to power the performance for the connected home, wearables and the connected car, the technical demands have raised the bar for the security and seamlessness for ingredient semiconductor suppliers.
Micron’s newest SLC NAND addresses these needs for high-performance storage technology to propel the market forward. Storing 1 bit of data per memory cell, SLC NAND offers fast read and write capabilities and boot times, excellent endurance and reliability, and with new generation 25nm NAND—on-die ECC algorithms enabling advanced security features and data corruption protection. For small form-factor designs and applications requiring speed, endurance and security, SLC NAND is the best choice.
Micron’s newest SLC NAND delivers improved reliability, program and read performance delivers optimal data retention and fast boot with 133Mhz SPI3 interface; initial 2x nm NAND with ideal program and read performance and best-in-class reliability (10 year uncycled data retention at 85°C and 100K P/E) for small form factor fanless designs and storage of critical boot code in environments including automotive.
It also includes on-die error correction code (ECC) supported for both parallel NAND and SPI interfacesAdvanced security features include permanent block locking and one time programmable data (OTP) capability, ensure protection at the deepest level of connected industrial, consumer, home and automotive applications. Low pin count SPI NAND interface reduces cost while enabling cost-effective code and data storage option in small form factors.
1, 2, and 4 Gb densities are available in SPI and parallel NAND product solutions.
“Micron works closely with chipset partners and customers within the ecosystem to design tomorrow’s products that meet the complex NAND requirements fueled by IoT and automotive,” said Aravind Ramamoorthy, product line director of NAND flash for Micron’s Embedded Business Unit. “The new SLC NAND Flash technology enable a new category of embedded applications that need reliable, high-performance, low pin count and secure4 memory for code and low density data storage.”
In order to simplify system design and speed time-to-market, Micron has engaged with semiconductor and system designers to ensure that Micron’s newest NAND Flash exceeds the data storage and memory needs for up-and-coming products.
“Broadcom is committed to bringing the best features and cutting edge technologies to our customers. We are delighted to see Micron launch Serial NAND product offerings which provide our customers with a new cost-effective option for high-density non-volatile memory,” said Dr. John Liberati, associate technical director, Broadcom.
