The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50mm x 25mm), production-ready embedded module, ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices requiring the latest on-device AI powers.
Intrinsyc’s Open-Q 845 μSOM is ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm Snapdragon SDA845 SoC, their latest IoT chipset. With the third-generation Qualcomm AI Platform, Spectra ISP, Kryo Octa-core CPU, Hexagon DSP, and a new dedicated secure processor, the 845 μSOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices.
In addition to the 845’s processing capabilities and on-device AI powers, it also includes new and improved I/O interfaces compared to previous Snapdragon generations — four camera ports, two USB3.1 ports (including 4K60 DisplayPort + concurrent SS data), and a Gen3 PCIe interface.
Featuring the Qualcomm SDA845 system on chip (SoC) from Qualcomm Technologies, the 845 µSOM integrates various capabilities in the same small form-factor, including higher performing octa-core CPU – up to 2.6GHz on gold cores; new hardware-based security layers for vault-like defense; third generation Qualcomm AI platform for immersive, on-device intelligence; four camera ports with flexible configurations supports up to seven cameras; new camera architecture for cinema grade video capture; DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency; additional USB3.1 port for device connectivity while using DisplayPort; and Gen3 PCIe interface.
This hardware platform will be supported by a host of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Q2 next year. The Android 9 operating system will be shipped on the development kit and is an ideal starting point for evaluation of the SOM and to kick-start your product development.
If users prefer a Linux OS, that will be available to download from Intrinsyc and program onto the development kit. Full software documentation will also be included with purchase of the development kit.
To help IoT device makers accelerate time to market, Intrinsyc offers the Open-Q 845 µSOM Development Kit, a full-featured platform including software tools, documentation, and optional accessories – everything required to immediately begin evaluation and product development. The development kit marries the production-ready Open‐Q 845 µSOM with a carrier board providing numerous expansion and connectivity options to support development and testing of peripherals and applications.
The development kit, along with the available documentation, also provides a functional reference design for your own custom carrier board. This will provide a low-risk, fast track to market for your latest new product.
“We are excited to introduce this premium performance IoT computing module featuring; ultra-fast computational power, support for variety of AI frameworks, advanced video and image processing capabilities, an integrated secure processing unit, and other trailblazing features,” said Cliff Morton, vice president, Solutions Engineering, Intrinsyc. “We will launch our development kit and SOM in the fourth quarter, 2019 and already have clients developing products with plans for commercial product launch in the first quarter, 2020.”
“Intrinsyc is a leader in developing embedded solutions for IoT products, and we’re excited to see them offer a premium-tier system to provide cutting-edge embedded solutions for drones, robots, and other applications using our Qualcomm SDA845 chipsets,” said Dev Singh, director, business development and head of robotics, drones, and intelligent machines, Qualcomm Technologies.