Intrinsyc launches System on Module based on Qualcomm SDA660 for use in 4K cameras, gaming, digital signage, other IoT devices

Intrinsyc Technologies, provider of solutions for the development and production of embedded and Internet of Things (IoT) products, announced on Monday availability of the Open-Q 660 µSOM (micro System on Module) and Development Kit, which is an ultra-compact (50mm x 25mm) production-ready embedded computing module.  

The SOM is powered by the Qualcomm SDA660 system on chip (SoC), a product of Qualcomm Technologies, and is designed to support high-performance, intelligent, on-device processes utilizing heterogenous compute capabilities to power a variety of high-performance consumer and industrial IoT devices.  

The Qualcomm SDA660 features eight Qualcomm Kryo 64-bit 260 cores that are divided in two clusters – a fast cluster of four cores with up to 2.2 GHz and a power saving efficiency cluster of four cores with up to 1.8 GHz. Additional high-end features in Qualcomm SDA660 mobile platform include the Qualcomm Artificial Intelligence (AI) Engine, Qualcomm Spectra ISP, and Qualcomm Hexagon 680 DSP with Hexagon Vector eXtensions (HVX), designed to support Caffe2 and Tensorflow for machine learning and image processing.  

“Intrinsyc’s Open-Q 660 µSOM is an ideal platform to power the growing demand for consumer and industrial IoT devices capable of artificial intelligence and machine learning,” said Cliff Morton, Vice President, Solutions Engineering, Intrinsyc. “To assist with integration of our System on Modules into customer products, Intrinsyc offers strong capabilities in all phases of product development. Services include everything from electrical and mechanical design to software development, including camera and audio tuning, artificial intelligence, power optimization, device management, security, and more.“

“We are proud to see Intrinsyc’s new micro-SOM product being powered by the Qualcomm SDA660,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies. “Qualcomm Technologies is driving the Internet of Things forward with our cutting-edge compute and connectivity technologies, and we are honored to enable a bright future of IoT devices along with Intrinsyc.”

To help IoT device makers accelerate time to market, Intrinsyc provides the Open-Q 660 µSOM Development Kit, as well as turnkey product development services, driver and application software development, technical support, and documentation. Intrinsyc’s Open-Q 660 µSOM Development Kit is a full-featured development platform including the software tools and accessories required to immediately begin development.

The development kit marries the production-ready Open‐Q 660 µSOM with a carrier board providing numerous expansion and connectivity options to support the development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible. The Development Kit is available for purchase.

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