Infineon Technologies extended its embedded SIM (eSIM) portfolio with the new OPTIGA Connect eSIM solution for mobile consumer devices. This solution fully supports all GSMA standards from 3G to 5G and securely authenticates the device to the subscribed carrier network of choice.
Available from this month, the OPTIGA Connect OC1110 is ideal for smartphones, tablets and wearables like smartwatches or fitness trackers thanks to its small footprint. Combining hardware and software in an easy to integrate system, Infineon helps manufacturers to develop product designs efficiently by reducing their eSIM integration efforts and time to market.
OPTIGA Connect is based on Infineon’s certified hardware SLC37, combined with a fast, interoperable operating system. It fully complies with the latest 5G specifications from GSMA (SIMalliance Profile Interoperability 2.3 Spec) and 3GPP (Release 15). It supports the profiles of major mobile network operators (MNOs). Remote SIM provisioning (RSP) means that carriers can be added or changed over the air provided the device is equipped with a local profile assistant (LPA).
It offers up to 1.2 MB of free user memory for network operator profiles, data and additional applications. Its ultra-small package size of 2.9 x 2.5 x 0.4 mm gives designers new-found freedom – especially useful for devices such as smart wearables where PCB space is at a premium.
Based on Infineon’s proven SLC37 security chip, the new OPTIGA Connect solution meets the GSMA’s security requirements and is tested according to Common Criteria CC EAL4+ high. The chip at its core provides a robust and trustworthy vault which is necessary to secure sensitive keys and data against fraudulent use.
Furthermore, the solution fully complies with the latest 5G specifications from the GSMA (SIMAlliance Profile Interoperability 2.3 Spec) and the 3GPP. It supports the profiles of major mobile network providers with Remote SIM Provisioning capabilities and offers up to 1.2 MB of free user memory for network operator profiles, data and additional applications. The ultra-small package size of only 2.9 mm x 2.5 mm x 0.4 mm allows completely new designs, especially for devices where printed circuit board space is of greatest value.
According to the global tech market advisory firm ABI Research, global shipments of eSIM enabled smartphones is expected to propel to over 225 million in 2020. Based on a continuation of eSIM support from leading handset manufacturers and eSIM expansion into other device ranges, ABI expects a minimum of 500 million eSIM capable smartphones to ship globally in 2024.
